Two months ago, Director Li from an electronics factory specializing in automotive chip packaging in Ang Mo Kio Industrial Park, Singapore, found us through the official website. His face was full of anxiety during the video conference: Due to insufficient dust control in the workshop, the chip packaging yield of the newly put into production SMT patch production line has always remained at 82%. Especially when welding 0201 specification micro components, there are frequent false soldering problems caused by the adhesion of 0.5μm particles, and the delivery window for German automobile customers is about to be missed.
After the initial communication, we immediately started the cross-border service process: First, Director Li sent the workshop CAD layout and production equipment dimensions, and simultaneously coordinated with the local cooperative testing agency in Singapore to conduct on-site inspections. Data feedback shows that the existing environment in the workshop only meets the 100,000-level clean standard, while automotive-grade chip packaging requires a local 10,000-level clean space (ISO level 7). Considering the high cost of industrial land in Singapore and the traditional clean room renovation cycle of up to 3 months, we recommended the modular clean shed solution - this prefabricated system can be quickly assembled and flexibly adapted, which meets the efficient needs of local electronics companies.
Combined with their assembly line rhythm, we designed a zoning plan of “10,000-level cleanliness in the packaging area + 100,000-level cleanliness in the detection area”: using an anti-corrosion industrial aluminum profile frame with anti-static PVC curtains to block external contamination. The core area is equipped with an H14-level HEPA filter and an intelligent FFU air supply unit to ensure that the number of 0.5μm particles per cubic meter does not exceed 352,000. In order to meet Singapore's import compliance requirements, we have processed CE and ISO certification documents in advance, and confirmed the customs clearance standards corresponding to HS code 6307.
After the contract was signed, we completed the prefabrication of all components within 15 days - each frame component was marked with a unique number, and the FFU unit completed a 72-hour start-up test in advance and generated an inspection report, which was sent to the Port of Singapore through the Shanghai Port along with the customized installation toolbox. Considering the inconvenience of cross-border installation, we specially upgraded our remote guidance service: sending 3D installation animations and step-by-step instructions 3 days in advance, organizing a technical team to conduct 2 rounds of video rehearsals with customer workers, focusing on the accuracy requirements of key steps such as frame splicing and filter installation.
After the components arrived at the port, we started four days of remote installation guidance: we synchronized the progress through video connection at 9 a.m. every day, and used screen sharing to mark the installation details in real time - for example, we reminded that the hanging curtain should maintain a 10cm droop to ensure tightness, and that the FFU should be fixed with a level to calibrate it to an error of ≤2mm. When encountering the problem raised by the customer that "the curtain at the assembly line interface hinders the operation", the technical engineer hand-drawn and modified the schematic diagram on the spot to guide the adjustment of the opening position to suit the production rhythm.
On the day of completion, the local testing agency in Singapore conducted on-site acceptance: the temperature and humidity in the shed were stable at the optimal range of 23±3°C and relative humidity of 45%-65%, and the cleanliness fully complied with ISO Level 7 standards. We check the inspection data through video connection, send electronic inspection reports simultaneously, and conduct one-hour remote maintenance training, using animations to demonstrate the filter replacement process and key points of electrostatic protection.
Three weeks later, Director Li sent good news: after the clean booth was put into operation, the chip packaging defect rate dropped sharply from 18% to 5%, and the yield rate exceeded 95%. Not only did it successfully deliver the German order, it also won supporting orders from local semiconductor companies in Singapore due to its quality stability. Last week he contacted us again, planning to customize 3 sets of the same clean booth for the newly expanded test workshop, and hoped to add a real-time environmental monitoring system to facilitate remote viewing of parameters in the booth through a mobile phone.